Parasitic RLGC Properties of High-density Through-Glass Via

The increasing demands for high-performance signal transmission in microelectronic systems have led to the development of advanced integration techniques, such as three- dimensional (3-D) integration. Through-glass via (TGV) technology offers superior electrical characteristics compared to conventional silicon and PCB. However, the parasitic RLGC parameters of high-density TGVs lead to signal attenuation, distortion, and reflection, posing challenges to signal integrity. In this paper, the HFSS electromagnetic simulation software is employed to analyze the transmission performance of high-density TGVs with a Ground-Signal-Ground (GSG) transmission structure across the 10–50 GHz frequency range. The parasitic RLGC parameters are extracted, and solution formulas for the parasitic inductance and resistance of TGVs in three morphologies are derived. Additionally, the contribution of TGV internal inductance to total parasitic inductance is also discussed. The results of this work provide insights into signal transmission in high-density TGVs, contributing to the development of microsystem integration.