The bonding mechanisms and reliability of pressure-assisted Cu sintering on Cu/Ag metal surfaces

Copper sintering paste has gradually emerged as an exemplary interconnection material in wide bandgap semiconductor processes due to its cost-effectiveness, excellent thermal-electric properties, and robust resistance to electron migration. Currently, active exploration of industrial applications of copper paste is underway. However, there remains a significant lack of research on the connection mechanisms and reliability of copper sintered joints on different metal-coated substrates. To promote the application of copper sintering technology across various fields, it is imperative to investigate the bonding mechanisms and reliability of copper sintered joints on substrates with various metal coatings. Previously, our team investigated a copper paste capable of controlled in-situ copper carrier generation. Building upon this foundation, this paper discusses the bonding performance and reliability of sintered joints prepared via pressure-assisted sintering using this copper paste.