The Failure Analysis of 3D-Stacked Die Packaging Flash

The IC package has gradually evolved from traditional 2D plane package to advanced 3D-stacked package. In 3D-stacked die package, multi-layer dies are usually stacked together, and there are dense interconnection structures. The structures are complex, which brings more difficulties and challenges to the reliability and failure analysis of devices. In this paper, a failure analysis was carried out on a 3D-stacked die packaging flash. The I-V test, (3D) X-ray, OBIRCH failure location, and FIB had been used. The characteristics of the interconnection structure of the 3D-stacked die package and generalized failure analysis methods were summarized.