Research on the Cleaning Machine Suitable for the in-Package Board-Level Stacking Structure

The SiP board-level stacked package achieved through BGA technology is crucial to improving integration. For the cleaning of flux after RF SiP board-level stacking, the research designs a multifunctional centrifugal spray cleaner. It introduces its whole structure, workflow, and central working units. The cleaning application tests show that the cleaning result meets the GJB5807-2006 Requirements for ionic residues on the surface of third-grade high-reliability electronic products of less than 1.56ug (NaCl)/cm
²
. This equipment, featuring diversified cleaning methods, small size, low water consumption, and a high degree of automation, can effectively improve flux cleaning for complex electronic products after stacking.