Determination of Shield Height of Power Amplifiers Using 3D EM Simulation

This paper presents the effect of shield height for the power amplifier module during packaging. The aim is to demonstrate the critical height of the cavity for which there are no further reflections leading to resonance. This is critical to ensure the expected performance and safe packaging of the power amplifier module. The analysis performed captures the electric field at different heights and the impact on S-parameters. The effect of various materials used for shield and product enclosure is also demonstrated. This is verified through the radiated emissions test under FCC part 15-H and 15B class B limits.