Chandrayaan-3 Lander Module Assembly, Integration and Testing

The Chandrayaan-3 Lander involves significant complexities due to the dense packing of electronic systems, including power systems, Lander electronics packages, radio frequency systems, sensors and actuators. This paper addresses challenges in system-level integration and extensive testing needed for timely spacecraft realization. It details the electrical integration team’s key activities, such as layout studies, electrical distribution design, fabrication, testing and grounding implementation. Additionally, it outlines the development and execution of complex test plans carried out in cleanroom, environmental test facilities, during composite module assembly and in launch pad to ensure that the spacecraft meets all operational requirements for orbit.