Performance Envelope Enabled by CVD Diamond Heatspreader Integration in Semiconductor Chips

We report the impact of integration of CVD microcrystalline diamond layers in chip and package of advanced silicon-based processors. The integration increases the junction to case thermal conductance by 84% and reduces the junction temperatures by 20°C. Computing performance is increased by an equivalent of advancing one processor generation. Impact of alternative heatspreading materials is reported and compared showing an absolute advantage for the diamond layer integration.