Signal Integrity Augmentation Techniques for the Design of 64-GBaud Coherent Transimpedance Amplifier in 90-nm SiGe BiCMOS

This paper presents signal integrity augmentation design techniques in a 64-GBaud transimpedance amplifier (TIA) for coherent optical communication. In the FE-TIA, a bonding wire ringing reduction technique and an input DC current cancellation (IDCC) loop adapted for coherent communication are proposed. In the post amplifiers, a group delay variation (GDV) friendly bandwidth boosting technique is proposed to achieve optimal time domain performance. A non-linearity cancellation technique and a high-linearity gain control approach are proposed in both circuit and system levels. These signal integrity augmentation techniques form a toolkit to solve the design challenges in bandwidth, linearity, GDV, ringing, offset, crosstalk, etc. in high-speed high-order modulation communication. Fabricated in a 90-nm SiGe BiCMOS technology, the TIA shows input-referred noise current density of 15.1 pA/
$\surd $
Hz, bandwidth of over 40 GHz with GDV less than ±3.75 ps. The TIA gain can be adjusted between
$150~\Omega $
- 5 K
$\Omega $
, which enables maximum overload input current of 3 mApp. The total harmonic distortion (THD) is less than 3% and the crosstalk between two channels is less than -3 dB. The chip consumes 264 mW from 3.3 V supply.