Analysis and Optimization of Random Vibration Fatigue Life for Stacked Solder Joints Based on Orthogonal Experimental Design

A finite element simulation model for stacked solder joints was established and subjected to random vibration modal analysis and stress-strain analysis. Based on the Manson high-cycle fatigue empirical formula, combined with Miner’s linear cumulative damage theory and the Steinberg model, the fatigue life of the stacked solder joints was predicted. A random vibration testing platform was constructed to perform fatigue life tests, validating the accuracy of the simulation results. Using solder ball diameter, solder joint height, and pad diameter as influencing factors, nine sets of stacked solder joints with different structural parameter combinations were designed using orthogonal experimental design. The vibration fatigue life of these nine sets of solder joints was predicted and analyzed using range analysis. The results indicate that the pad diameter has the greatest impact on the fatigue life of the stacked solder joints, followed by solder ball diameter, and then solder joint height. The optimal structural parameter combination for the longest fatigue life is: solder ball diameter 0.60 mm, solder joint height 0.48 mm, and pad diameter 0.50 mm.