Opportunities, Challenges and Mitigations in 3DIC Design, Test, and Analyses

As 3D Die-on-Wafer and Wafer-on-Wafer stacking technologies mature, integration density will increase to provide new opportunities for complex homogeneous or heterogeneous integration of logic circuits across multiple materials and through multiple interconnect materials and technologies. This will create opportunities for new advancements in design, verification and analyses tools and design flows, test strategies and test planning, and system level practices.