Usage and Preliminary Exploration of Signal Integrity Analysis Models Based on CST Studio Suite

In the transmission process of high-speed digital signals, signal integrity is crucial. This paper explores the impact on signal integrity from the top layer to the bottom layer and the differences caused by various PCB material properties. Using CST Studio Suite's built-in Signal Integrity Analysis model as an example, Signal Integrity Time Domain Analysis is performed by altering PCB dielectric parameters. Finally, the eye diagrams obtained from simulations are analyzed and compared. The results indicate that at 100 MHz, the impact on signal integrity from the top layer to the bottom layer is more significant compared to simulations using different PCB material properties.