Signal Integrity Analysis Between Continuous Vias and Indirect Vias on RDL Circuits

This study investigates the performance of continuous vias and indirect vias in Redistribution Layer (RDL) circuits. Through simulation and analysis using CST Studio Suite, a comparison is drawn regarding the signal integrity, impedance variation, and eye diagram characteristics of these two via designs. The findings reveal that continuous vias demonstrate superior signal integrity over long-distance transmission, while indirect vias exhibit more stable impedance characteristics. Additionally, the eye diagram analysis highlights that continuous vias display larger fluctuations compared to indirect vias, indicating greater waveform variability. These results lead to the conclusion that continuous vias are preferable for applications requiring strict timing or routing constraints, whereas indirect vias offer better overall performance. Understanding the trade-offs between these two via designs is crucial for optimizing RDL circuit designs to meet specific application requirements.