Evaluating Aging Uncertainty of Impedance Standard Substrate in On-wafer S-parameter Measurements

The behavior and performance of RF on-wafer planar calibration circuits change throughout their lifetime. To understand the limits of operation and how the environment affects the performance of reference wafers, accelerated thermal aging tests are conducted to simulate real-world harsh conditions. The aging errors of on-wafer devices measured before and after thermal aging are found to be smaller than the contact repeatability of RF probing up to 50 GHz.