Flip-chip encapsulation of Graphene-Based Quantum Resistors

Achieving sustained stability of graphene-based quantum resistance standards has been the focus of many works with some major improvements in recent years. A novel approach combines existing solutions with flip-chip technology, offering compactness and electrical contacts without bond wires and integrating electrical shielding and encapsulation. Expected benefits include enhanced stability, maintaining quantum resistor properties over years, improved contact accuracy, and possibly better AC shielding. Though in development, initial outcomes suggest this technique could enable the development of more robust and versatile graphene-based AC and DC quantum resistors.