Research on Related Technologies of Multi-needle Die Bonding Machine

This study aims to improve the solid crystal efficiency of Mini-LEDs by proposing an innovative bonding scheme for a new type of die bonder based on multi-needle technology. Compared with the traditional swing arm die bonder, this new die bonder has significantly improved solid crystal efficiency and precision control. Through the collection and analysis of the position error and angle error of the chips, this study optimized the coverage of the multi-needle design and used a combined branch and bound method and cutting plane method algorithm to plan the solid crystal path. Experimental results show that the multi-needle die bonder can effectively improve the parallel processing capacity of solid crystal operations and significantly improve processing efficiency under certain error requirements. In addition, compared with the traditional single-needle method, the multi-needle technology can significantly reduce the total path length required, thereby further improving work efficiency and reducing costs. This study provides a new technical approach and theoretical support for process optimization in the Mini-LED semiconductor production field.