An Intel 3 Advanced FinFET Platform Technology for High Performance Computing and SOC Product Applications

An advanced Intel 3 FinFET technology is presented that has been optimized to provide 10% logic scaling, a full node of performance improvement and improved reliability compared to Intel 4. Through transistor enhancements, interconnect optimization, and design co-optimizations, up to 18% performance gain at iso-power is achieved over Intel 4. Intel 3 additionally enables a 210nm high-density standard cell, 1.2V-native I/O transistors, deep N-well isolation, and long-channel analog devices to provide full-featured technology design capabilities.