Preparation of high thermal conductivity epoxy resin/boron nitride composite thin films using low-temperature plasma.

As the integration density of transistors in electronic devices increases, the heat flux density within electronic devices also gradually increases, while enhancing performance, this also increases the demand for heat dissipation in electronic devices [1]. In recent years, there has been widespread interest in exploring new two-dimensional materials. These materials, due to their size effects and interface properties, exhibit excellent thermal conductivity, offering promising solutions to high heat flux density issues [2]. Among them, boron nitride, due to its excellent insulation performance, thermal properties, corrosion resistance, and high stability, is expected to become a new generation of heat dissipation materials [3]. However, boron nitride mostly exists in powder form and cannot be directly applied; it needs to be prepared into thin films. Therefore, boron nitride can be used as a filler, incorporated into epoxy resin to prepare epoxy resin/boron nitride composite films [4]. However, the low surface energy and specific surface area of boron nitride powder make it difficult to form efficient thermal conduction channels between the powders, thus affecting the thermal conductivity of the composite film. The rapidly developing low-temperature plasma technology in recent years has provided new insights for addressing the above-mentioned issues [5]..Therefore, this article proposes a method using low-temperature plasma welding, where the transient high temperature of the low-temperature plasma triggers chemical and structural changes on the surface and inside the epoxy resin/boron nitride composite film, prompting the fillers to rearrange and form efficient thermal conduction channels inside the epoxy resin/boron nitride composite film, thereby improving its thermal properties