A Silicon Micromachined H-Plane Horn Antenna for Integration

This paper introduces a novel transition structure and a silicon micromachined H -plane horn antenna for antenna integration. The transition from thin film Microstrip line to airfilled rectangle waveguide (RWG) realized a $46 \%$ simulated impedance bandwidth from 50 GHz to 80 GHz and the insertion loss is better than 1.2 dB. Ridge gap waveguide (RGW) technology is used to enhance the impedance bandwidth. The Hplane horn antenna is fed by coaxial probe. It consists of air-filled metal horn and silicon support. Silicon-based micro electromechanical system (MEMS) technology is using for fabrication. Elliptical shape is used to decrease the spherical error. A prototype is fabricated to verify the design. The proposed Hplane horn antenna achieves impedance bandwidth from 56.5 to 57.5 GHz with a peek gain of 6.5 dBi at 57 GHz.