EM-Thermal Correlation Technologies for Industrial-Testing of 3D Heterogeneous Chip-Package-PCB-Antenna Modules

A hybrid RF-optics electromagnetic-thermal-imaging correlation-technology for over-the-air industrial-testing of 3D heterogeneous chip-package-PCB-antenna modules in a unified sub-10GHz and mmW platform is presented. Fast multi-channel RF-correlators are combined with advanced transient multi-beam thermal-imaging achieving time-resolutions from millisecond(ms) to microsecond(
$\mu \mathrm{s}$
) scales in synchronized pulsed modes enabling ultra-fast testing solutions suitable for industry mass-production requirements. Thermoreflectance imaging technologies can meet the challenges imposed by advanced chip-package-PCB-antenna modules by providing sub-micron spatial resolution(beyond diffraction limit) and temporal resolution in the picosecond range. The proposed testing technology is validated through several practical applications using front-end-modules(FEMs) manufactured in advanced heterogeneous GaN and FDSOI technologies co-integrated with antenna-in-package(AiP) modules in various packages including WLCSP fan-in/fan-out, system-in-package(SiP), package-on-package(PoP), and multi-chip-modules(MCM). The proposed test solutions bridge modeling and measurement into a common framework, offering benefits that include productivity enhancement and facilitation of Digital-Twin requirements.