Analysis of High Power Microwave Coupling Effect of PCB Traces

With the exponential growth of electronics, intentional electromagnetic interference (IEMI) poses a threat not only to the military sector, but also to the civilian sector. Especially when the high-power microwave energy is irradiated onto critical facilities, it will interfere with the information transmission of electronic equipment, and seriously cause damage to electronic equipment. Under the influence of high- power microwave environment, the internal modules of modern unmanned aerial vehicles (UAVs) will be interfered by the electric field coupled in the holes. In the susceptible modules, the electric modulation module is connected to the motor inside UAVs. In the high-power microwave environment, conditions such as flight instability, loss of control, signal disruption and reduced flight performance may occur, which may cause irreparable damage to UAVs. This paper adopts the FDTD algorithm and electromagnetic simulation technology to predict the coupling characteristics of the PCB traces of the electrical modulation module in a high-power microwave environment. Firstly, based on the parallel FDTD algorithm, octree algorithm, and metal conformal technology, the coupling law of PCB traces of electric modulation module in different angles is analyzed. Finally, three-dimensional electromagnetic simulation software CST is used to model and simulate under the same high power microwave conditions. The CST simulation results are compared with the program calculation results, and the accuracy of the program is verified.