Study on Compact Thermal Model for 3D Interlayer Electronic Cooling Based on Fluid-Solid Coupling Heat Transfer

this paper presents a 3D Interlayer Cooling Emulator written in C++ and python language, in which a common Compact Transient Thermal Modeling (CTTM) of solids and fluids based on an equivalent circuit of convection thermal resistances is proposed. Compared to the state of art tools such as 3D-ICE, our previous in-house 3DDCTM fast thermal simulation tool, the present method has the ability of calculating the heat transfer between solid and fluid much more accurately by solving the unsteady heat convection-diffusion problem in the whole domain, rather than using a semi-empirical correlation. To verify the correctness of the proposed method, three typical tests including 3D interlayer cooling are implemented and maximum relative deviation of the junction temperature is 2.83% compared with results from commercial tools demonstrating the high precision of the present tool. Moreover, the proposed Emulator could greatly reduce the calculation time and in the test about 157 times faster than commercial tools are observed.