Guest Editorial for Special Issue on Papers From 2023 IEEE International Conference on Flexible Printable Sensors and Systems (FLEPS)

This Special Issue of the IEEE Journal on Flexible Electronics (J-FLEX) showcases the expanded papers presented at the 2023 IEEE International Conference on Flexible Printable Sensors and Systems (FLEPS), held in Boston, MA, USA. FLEPS was organized by the IEEE Sensors Council. The advancements in flexibility and printability are reshaping the landscape of electronic device design and production, sparking great enthusiasm globally for the field of flexible and printable electronics. FLEPS served as an excellent platform for engaging in discussions about the latest advancements in the field and shaping future pathways for sensors utilizing unconventional materials and manufacturing technologies. FLEPS garnered an enthusiastic response, attracting leading experts, researchers, and innovators from both academia and industry. The technical program of FLEPS 2023 comprised over 150 presentations spanning three days. Submitted papers underwent a rigorous peer-review process. The authors whose papers were accepted were encouraged to submit extended versions for consideration, hence the creation of this special issue.