Transmission Line Designs on Glass-Embedded Fan Out Antenna in Packaging for 5G Applications

In order to improve antenna performance of a Fan Out Antenna in Package (FO_AiP), a novel glass-embedded FO _ AiP array had been proposed, and the array antenna design has been demonstrated to be suitable for applications in the 5G millimeter-wave (mmWave) frequencies. However, the influence of transmission lines, which is needed for actual applications, was not considered previously. In this work, the transmission line considerations on a
$1\times 2$
array glass-embedded FO_AiP were studied. To this end, a single FO_AiP was first analyzed using ANSYS HFSS software to complete the structure design. Subsequently, the combination of a single antenna with transmission lines was studied, and it was found that a 90° corner transmission line design is preferred to reduce the antenna-like effects produced by the transmission lines. The design of the
$1\times 2$
array antenna with transmission lines was next performed using single-factor analysis, followed by a continuous procedure for structural improvement. Ultimately, a
$1\times 2$
FO _ AiP array with 7.1 dB gain, 5.24 GHz bandwidth and 59.91 GHz central frequency is proposed for 5G, 60 GHz band applications.