Power Diode Packages with Embedded Microchannel Cooler: Is Further Improvement Possible?

Paper presents results of numerical electro-thermal investigations of a press-pack package with embedded micro channel coolers designed for power diodes. High efficiency of cooling structures allows elimination of external cold plates, but may result in non-uniformities of temperature distribution in the semiconductor pellet. Investigations on coolers geometry depicted possibilities of further improvement of the novel package. Thermal resistance of 8K/kW can be achieved with temperature difference of 12.5°C in the semiconductor device.