Experimental Study of a Novel Printed Circuit Board Interconnection Technology

In this study, we present a novel printed circuit board (PCB) interconnection technology known as KlettWelding, offering a promising solution for connecting PCBs, resembling board-to-board connectors. This joining process is significantly more energy-efficient than traditional methods such as sintering and soldering, as it operates at room temperature. Furthermore, this approach eliminates the need for organic additives commonly found in sintering and soldering pastes. Copper (Cu) serves as the preferred conductive material in PCBs, facilitating the realization of stacked PCBs connections through Cu/Cu bonding with KlettWelding at room temperature. This study highlights the achieved connections, emphasizing both their potential and the challenges they presented. We investigate and discuss the obtained measurement results concerning connection quality and electrical properties. The measurements were conducted based on the four-point probe method, utilizing a well-established measurement setup, across a temperature range from 10°C to 70°C. Additionally, we compared the obtained results with those of similar interconnections fabricated through reflow soldering.