The use of bending experiments for the efficient characterization of the mechanical functionality of component interconnections

The formation of cracks in both electrical components and their interconnections is a huge problem in the use of electronic devices because they typically result in a total failure of the system. In order to minimize resulting repair or replacement costs, an accurate understanding of the crack formation process is necessary, e.g. with the help of suitable experiments. One possibility would be the use of temperature cycling tests, but such tests involve long periods of time lasting several months and cause high costs. Another option that has not yet established in this context is the use of bending experiments which can be conducted in a much shorter time. This paper presents the results of four-point bending tests on MLCC (multilayer ceramic capacitor) and QFN (quad flat no leads package) components to discuss their ability to evaluate the robustness of components and solder interconnects. Subsequent FEM (finite element method) simulations were carried out in order to account for true strains and stresses that occur during the test in the solder interconnects of the components.