Study of Thermal Loading of Ceramic Capacitors during Reflow Soldering

Simulation studies were carried out using the computational fluid dynamics approach (CFD) provided by the ANSYS software framework. The goal of these studies was to make thermo-mechanical assessments of unsoldering MLCC components from a PCB. Various MLCC components were soldered on a standard board with a thickness of 1.6 mm. Soldering was performed in a batch reflow oven (LPKF ProtoFlow S). Disassembly was carried out using a Hakko FR811 soldering repair station. The paper shows the results of the CFD simulation in the combination with the thermo-mechanical simulations within the ANSYS software framework.