Capillary Printing of Fine Structures on Flexible and Hybrid Substrates

Flexible hybrid electronics (FHEs) have garnered considerable attention for their diverse applications. Efforts are underway to fabricate miniaturized and cost-effective sensors. While various printing technologies exist, each has its advantages and limitations. High Precision Capillary Printing (HPCAP) addresses these challenges. It utilizes capillary forces and resonance for ink deposition, achieving high resolutions with exceptional precision. This paper presents HPCAP’s mechanisms and capabilities, emphasizing its high resolution, substrate versatility, and ink compatibility. Case studies demonstrate its ability to print micron and sub-micron structures and adapt to diverse substrate topographies, offering promise for flexible and hybrid electronics applications.