A Novel Image Deep Learning for Recognition of Silicon Photonics Redistribution Layer

Due to the design requirements for miniaturization and high-density placement of silicon photonics (SiPh) components in integrated circuit (IC) packaging, the system in package (SiP) process and equipment have become important but challenging. Automatic optical inspection (AOI) detection equipment in IC packaging lines is also important in identifying redistribution layer (RDL) anomalies that affect signal transmission. If the AOI misrecognition rate is too high, the production yield and overall equipment performance are lowered. To solve the above problems, we proposed a novel Pix2Pix generative adversarial network (GAN) algorithm based on machine learning methods. The new feature extraction method has demonstrated highly sensitive image detection capabilities after processing tens of thousands of huge SiPh RDL image databases.