Panel-Level Plasma Development

We designed a descum process based on the RF plasma system for semiconductor packaging. When the plasma is working, a glow is produced inside the chamber. The contact angle of the treated substrate was measured, and the descum process was performed under the optimal chamber vacuum of 700 mTorr, and the hydrophilicity was significantly increased to 38°. This experimental result proved that the RF system ensured that the substrate stably achieved hydrophilic quality during the plasma descum process.