A Model for Simulation of the Temperature Field of Flexible Printed Circuit Boards

The thermal regime of electronic modules is crucial for their reliable and trouble-free operation. In this study is developed a model for simulation of the temperature field of flexible printed circuit boards (PCB). It relies on the Finite difference method and physical dependencies and was implemented in a software tool for simulation. An experimental set-up was prepared in order to validate the developed model. A flexible PCB with a voltage regulator was powered and its temperature transient response was recorded with the thermal camera. The temperatures were analyzed by dividing the observed area into 6 zones and their average value was obtained. The validation of the model was implemented by comparing the experimental and modelled transient response of the first and the last temperature zones. The relative error varies between 0.11 and $5 \%$, with the lowest values being under steady-state conditions and the highest - in the initial stages of the transient response. The developed model could be used for analysis the temperature field of flexible PCBs under different exploitation conditions.