A 3-D Heterogeneously Integrated Application of the RF-Module With Micro-Bump Filter and Embedded AiP at W-Band

In this study, we present the design, fabrication, and measurements of a 3-D heterogeneous integrated RF-module at W-band. A 3-D transition structure based on micro-bumps is fabricated and measured to obtain the transition loss of one bump. One micro-bump has an insertion loss of 0.21 dB at the W-band. A packaged filter and a benzocyclobutene (BCB)-based back cavity antenna are designed and analyzed in detail. The filter has a 2.6-dB insertion loss at 94 GHz with four transmission zeros (TZs) and a
$2.14f_{0}~10$
-dB stopband. An extra loss of 0.9 dB is found after packaging. Then, the filter and antenna are integrated with a SiGe-based low-noise amplifier (LNA) and a mixer to realize a fully packaged receiver by using our in-house Si-based micro-electromechanical systems (MEMS) through-silicon-trench (TST) technology and multilayer photosensitive composite film. The proposed 3-D heterogeneous integrated receiver is measured on-wafer. This low-loss packaging solution can be further used in millimeter-wave communication or radar systems.