Embedded component packaging for D-band radio systems

The paper presents an embedded component packaging platform for D-band radio systems. The embedded component packaging is highly reliable due to optimal protection of the embedded components and good heat dissipation. Key elements of the platform are tested. The testing shows promising results in terms of insertion loss, achieving~0.5 dB per transition at 150 GHz. However, isolation of the RF lines feeding phased array chips should be improved in the next version of the platform.