Dynamic modeling and analysis of wafers in near-field acoustic levitation

The application of near-field acoustic levitation (NFAL) is increasing in popularity due to its practical applications in industry. This article presents a fluid-structure coupling model based on finite element analysis (FEA) for the dynamic analysis of wafers in NFAL. Initially, the one-eighth spherical shape equivalent model of NFAL was developed. Based on this model, static and transient investigations were conducted, respectively. Subsequently, various conditions that impact the wafer in NFAL, including deviation, initial velocity, and oscillation, were investigated. Finally, a mass-spring system with a single degree of freedom was explored. These results validated the feasibility of the wafer manipulation in NFAL and provided a practical method for dynamic modeling and analysis of wafers in NFAL.