Dynamic Multi-physical Field Coupling Analysis for Enhanced Electromagnetic Driving Devices

In order to solve the dynamic multi-physical field coupling problem in the working process of electromagnetic drive devices, a three-dimensional dynamic electromagnetic-heat-force coupling model is proposed. The dynamic distribution of current density, temperature and stress on the armature and rail during the driving process is analyzed. The results show that the current density, magnetic induction intensity and temperature are concentrated in the armature throat and the contact part between the armature and rail. And the Lorentz force is mainly concentrated in the armature throat. This model provides an important reference and guidance for the further optimized design of enhanced electromagnetic drive devices.