Design and Simulation Experiment of a New Magnetron Sputtering Cathode Surface Magnetic Field Structure

Magnetron sputtering is widely used in the field of material surface modification of low-temperature plasma, in which the magnetic field design of the cathode directly affects the quality of film formation and process cost. In order to optimize the magnetic field of the existing magnetron sputtering target, a structure with alternate distribution of internal and external magnetic yokes and permanent magnets is designed, and the finite element simulation experiment is carried out by using the method of parameter control variables. By studying the influence of magnetic circuit structure parameters on the magnetic field strength and distribution uniformity of the target surface, the parameters of key components such as permanent magnets and magnetic yokes were optimized and determined. The simulation results show that with the design structure of the cathode, the uniformity of the horizontal magnetic induction intensity on the surface of the cathode is 49.4% and the target utilization rate is 50.3%, which effectively improves the magnetic field uniformity and target utilization.