Molecular Simulation Analysis of the Influence of Resin Matrix on the Properties of Composite Foam

Epoxy composite foams, as a lightweight and highly insulating composite material, have been widely used in insulation filling of electrical equipment. This paper uses 2021P alicyclic epoxy resin to co-blend to change the performance of DGEBA, methyl hexahydrophthalic anhydride (MHHPA) as curing agent, the mixed epoxy resin and the curing agent MHHP A cross-linked with DGEBA and 2021P in four different ratios to form the epoxy resin system was studied. PMMA was selected as the organic microsphere. An amorphous hybrid model of DGEBA/2021P and MHHP A monomer molecules was built in the module of Materials Studio, and the program of automatic cross-linking reaction and annealing written was imported. The models were automatically cross-linked and annealed to generate the models after the reaction between epoxy resin and curing agent, and the cross-linking degree of all four models was above 85%. The four cross-linked epoxy resin models were merged with the same organic microsphere, and the structure of the model was analyzed. The mechanical and thermal properties of the two-layer model of epoxy resin and organic micro spheres were analyzed and calculated by molecular dynamics simulation. Research shows the glass transition temperature of the original resin system increases to 373 K when 10% of 2021P is added, but further increasing the content of 2021P, the glass transition temperature of the material decreases and is lower than that of the model without the addition of 2021P. The bulk modulus, Young's modulus and shear modulus of the system with 30%2021P are the highest.