Diamond Like Carbon Film Deposited via RF Plasma Enhanced Chemical Vapor Deposition for Insulating and Hydrophobic Properties in Advanced Nano-Electronics Applications

The rapid progress in nanoelectronics demands customized materials for compact electronic devices. There is a requirement for materials with customized properties to fulfill the strict demands of swiftly advancing nanoelectronics, especially for an insulation coating with hydrophobic characteristics to avert moisture-induced issues in electronic components. This study investigates Diamond-like Carbon (DLC) film deposition via Radio Frequency Plasma Enhanced Chemical Vapor Deposition (RF-PECVD) and analyzes its suitability for nanoelectronics applications. Systematic variation of deposition parameters, particularly power level, is undertaken to explore the morphological, structural, wettability and electrical characteristics of DLC films. Findings reveal significant impacts of deposition power on film properties: increasing power level from 40 to 120 watts results in water contact angle shifts from 88° to 102°, rendering the film hydrophobic. This change is accompanied by variations in roughness from 7.5 to 12.25 nm and film thickness from 125 to 165 nm, respectively. Additionally, variations in resistivity and conductivity are observed through Hall Effect measurements, with higher deposition power leading to higher resistivity and lower conductivity. The findings highlight the critical role of deposition parameters in tailoring DLC film properties for specific nanoelectronics applications, contributing insights for optimizing DLC synthesis to enhance insulation and wettability for future nanoelectronics devices.