Dielectric and Thermal Analysis of Diamond-Like Carbon Incorporated Power Substrates

Power electronics modules are integral components in numerous electronic devices and systems, facilitating the efficient conversion and control of electrical energy. However, as the demand for higher power densities and improved performance continues to grow, so does the challenge of managing the heat and high electric fields are generated within these modules. Diamond-like carbon (DLC) is an amorphous hydrogenated or non-hydronated form of carbon with attractive electrical properties and chemical inertness, among other things. It has a very high resistivity, dielectric strength, and high thermal conductivity. As a result, DLC has very good insulation properties and can be used effectively as coating on ceramic substrate or as an alternative to ceramic substrate. This study explores DLC as a coating on ceramic substrates or an alternative, addressing heat concerns. Conducting a comparative thermal analysis by finite element (FE) method using DLC-coated ceramic and DLC-replaced ceramic, the study shows significant improvement in the thermal properties of the power module, emphasizing DLC’s potential for effective insulation by investigating dielectric strength.