Automated Optimal Resistance Measurement Method for Precision Resistor Stress Response Analysis

This article presents a resistance measurement method developed for stress response analysis, specifically targeting the automatic positioning of measurement points to achieve maximum precision based on the measured resistance value. The encapsulation process, involving the pouring of material over silicon chips, introduces static mechanical stress in integrated circuits (ICs) that alters their performance characteristics. To compensate for the deviations caused by the stress, previously developed stress models can be used to simulate the stress response of complex circuits. To calibrate the models, the stress characteristics of the integrated components must be measured. Here, precise measurements are required because the stress-induced changes during the operation of the IC components are predominantly small. In this paper, a mathematical proof is presented that determines the optimal voltage-current measurement point for any resistance value and any measurement instrument. In addition, a measurement method is developed that automatically positions itself at this optimal measurement point. Experimental results show that this method consistently provides highly accurate measurements for a used range of resistance values.