Effect of Distributed Decoupling Capacitors in Multi-chip SiC Power Modules on Current Sharing Mechanism

The current sharing of paralleled SiC MOSFETs is critical for multi-chip power modules. However, most of the current balancing approaches in previous studies are complicated and limited to specific layout design, which is costly. Nowadays, the integration of distributed decoupling capacitors becomes a popular way to improve the performance of power modules. Thus, this article reveals the influence of integrating distributed decoupling capacitors in power modules on current sharing mechanism. The key parameters for dynamic and static current sharing are obtained, and an improved layout is proposed based on the theoretical analysis. The theoretical conclusions are verified by simulation and experiment. According to results, the current imbalance degree of the optimized layout is reduced by 106.7%, and it proves the superiority of distributed decoupling capacitors in multi-chip power modules.