A Fast Steady-state Thermal Modeling of Power Modules Based on Fourier Analytic Series

With the increase of power flow, the thermal management of multi-chip parallel modules becomes a prominent problem. The steady-state thermal impedance network is used to analyze module thermal reliability quickly and provide layout iteration information. Based on the analytical model of cube structure, this paper proposes a fast method to extract the temperature variation in the process of layout simplification. The compensated analytical model has high precision and calculational efficiency. Compared with the finite element simulation, the proposed analytical model represents robust expression of thermal process under different working conditions. The maximum error is less than 2%, and Only 27% of the computational resources of finite element simulation are required.