New Standard-under-Development for Chiplet Interconnect Test and Repair: IEEE Std P3405

IEEE Std P3405 is a new standardization activity under the umbrella of TTTC’s Test Technology Standardization Committee (TTSC). In 2023, a Study Group formulated a Project Authorization Request (PAR), which was approved and since December 1, 2023, the P3405 Working Group is active under elected chair Sreejit Chakravarty. This standardization activity focuses exclusively on the test and repair of chiplets’ inter-die interconnects. In the PAR, the scope of the activity is described as follows. "Chiplet-based designs contain dies using proprietary interconnect technology. These dies might come from multiple design groups. Inter-chiplet interconnects are dense, large in number, and prone to manufacturing defects. For cost-effective chiplet packaging, an effective and efficient mechanism to test and repair chiplet interconnects is required. The chiplet interconnect test and repair infrastructure is spread across chiplets and designed by multiple design groups, necessitating the need for a standard for chiplet interconnect test and repair. The purpose of IEEE Std P3405 is to enable interoperability of interconnect test and repair infrastructure of chiplets from multiple design groups. Chiplet-based designs involve multiple parties: Chiplet Maker(s), Packagers, and End User(s). Features supporting the test and repair of chiplet interconnects are part of individual chiplets, which are implemented by individual Chiplet Makers. These features are needed to serve the Chiplet Makers’ (prepackaging), Packagers’, and End Users’ test and repair objectives." In this special session, a handful prominent members of the Working Group express their personal views on the outcome of the standardization work. The views expressed are from the authors alone and do not necessarily align with the view of the IEEE Std P3405 Working Group.