Thermal Network Modeling of Heat Dissipation Structure of Power Devices with PCM to Enhancing Short-Term Overload Capacity

Modern electronic devices require power supplies with higher flexibility, such as the ability to handle short-term overload of power devices. Phase Change Material (PCM), with high heat capacity at specific temperatures, can be integrated into heat dissipation structures to address short-term overload. This paper proposes a power device heat dissipation structure with PCM, which effectively suppresses the increase in junction temperature during overload (Decrease by 45% in 5 seconds at 25W overload). Furthermore, a thermal network modeling method for this structure is proposed, and through simulation and experimental validation, it is demonstrated that the error of this method is less than 5%.