A Current Monitoring Method for Wire-bonding Power Modules based on Magnetoresistance-Planar Rogowski Coil

The wire-bonding power module has gained widespread adoption across various power converters, owing to its efficiency and broad power range capabilities. Within the module, intricate interactions exist among electrical, thermal, and mechanical domains, contributing to its complexity. The thermal and electrical distribution of semiconductor chips may affect current distribution, potentially leading to overcurrent in some chips. Detecting the current flowing through a power module holds significant potential for enhancing device reliability and facilitating health diagnostics. Nevertheless, challenges arise in effectively sensing the current of individual chips within the module, primarily due to constraints imposed by sensor bandwidth and size considerations. This paper introduces a solution to address this challenge by proposing a type of hybrid current sensors that integrates magnetoresistance (MR) technology and a PCB-type Rogowski coil. The complete design of the sensor is implemented on a compact printed circuit board measuring 17.5mm × 15mm. The sensor demonstrates a bandwidth ranging from DC to 30MHz. Its performance is validated through comparison with a commercial current probe, yielding an error rate of 2%.