Paralleled Multi-Chip Current Sensing PCB Coils for SiC Power Module

Within silicon carbide (SiC) power modules, the chip current is crucial for chip-level electro-thermal status monitoring, active current balancing, and other applications. Due to reasons such as magnetic saturation, non-linearity, and poor anti-interference capabilities, traditional current sensing methods cannot be integrated into SiC power modules. This paper proposed a new integrated PCB structure for SiC power module, playing the role of both low-inductance electrical connection and chip current sensor. The integrated PCB can be connected to the chips through bonding wires. And it possesses high bandwidth, sensor accuracy and anti-interference capability, without magnetic saturation. The double pulse tests results validated that the PCB embedded current sensor meets the requirements for measuring the current of SiC devices.