Quantifying the Electrical Impact of Bonding Misalignment for 0.5 μm Pitch Hybrid Bonding Structures

A 0.5μm pitch multi-level back-end-of-line (BEOL) test vehicle was developed to evaluate the performance of the wafer-to-wafer (W2W) bonding tool platform. Test structures with intentional pattern misalignment were included to quantify the systematic relationship between the measured electrical resistance and bonding process misalignment. This programmed shift is offset with the local alignment measurements and creates a continuous range of bonding pad contact areas with corresponding variation in the resistance values. This data set can be fit with an analytical model to separate the overall circuit resistance from the contact resistance sensitivity at the bond pad Cu interface.