A Novel FOPLP Structure with Chip First & RDL First Process for Automotive chip application

Based on the requirements of high-end automotive IC packaging, multiple active and/or passive sub-components interconnected to create a single complex circuit within a single Multi-Chip Module (MCM) package is a big trend for enhancing Autonomous Driving (AD) performance. In order to enhance performance and reduce cost of mass production, the panel-level package (PLP) is better choice than wafer-level package (WLP). In this study, ITRI has successfully demonstrated a novel FOPLP structure with Chip First & RDL First Process for automotive chip application.