Development of all-photonics-function embedded package substrate using 2.3D RDL interposer for co-packaged optics

Toward a next generation co-packaged optics, we have worked on a novel packaging substrate working as optoelectronic conversion engine and providing optical redistribution function and detachable optical connector. In this paper, we show design of the test vehicle using 2.3D RDL interposer and provide its thermal and electrical analysis results.