Preparation of SAC305 Solder Specimens that mimic the Microstructures of a Micro Solder Ball

This study investigates the creep properties of micro solder balls to predict the reliability of solder joints, which are crucial issues in the microelectronics industry. To manufacture Tensile creep specimens mimicking the microstructure of micro solder balls with grain structure, the free-standing micro solder balls were reflowed using Differential Scanning Calorimetry (DSC). They were characterized for their grain structure and intermetallic compounds (IMC). Based on the characteristics of result, the creep specimen was fabricated to determine the representative creep properties of micro solder balls larger than 400 μm. In future work, tensile creep testing will be conducted under different temperatures with various constant stresses. Specimens mimicking the microstructure of solder balls smaller than 400 μm will be fabricated to determine their creep characteristics through testing. Afterwards, Solder joint prediction model based on Garofalo’s creep model will be developed, considering representative creep properties of micro solderball with grain structure and interlaced structure.